Description
Covering current, cutting-edge developments, this new edition of an Artech House classic brings you up-to-date on every aspect of microwave circuit design and fabrication techniques. You get the latest information available on such topics as microwave circuit board materials, etching, and packaging in an easy-to-read format handy for novices and experts alike.; Since the second edition, the microwave industry has shifted from military applications to consumer applications, and dramatic improvements in computer-aided design have revolutionized the way design and fabrication work gets done. Microwave Materials and Fabrication Techniques, Third Edition, helps you understand these changes, their impact, and what they mean to you now and in the future. The books describes: New materials and how they fulfill new consumer application requirements; New programs used in microwave artwork - from initial layout to the photo process - that help you design more accurate circuits; Advances in etching and plating techniques. This book provides comprehensive coverage of the materials and techniques important for design engineers and helps marketing personnel understand ongoing changes in the industry. What's more, you can put this book to work for you immediately to produce microwave designs that perform at peak output in simulations and in the real world.
Table Of Contents
Introduction. Laminates & Substrates. Metals. Microwave Artwork. Etching Techniques. Bonding Techniques. Microwave Packaging. Appendix: Dielectric Constants. Coefficients of Expansion. Microwave Laminate Data Sheets. Connector Information.
Author
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Thomas S. Laverghetta
Thomas S. Laverghetta is a professor of electrical and computer engineering technology at Purdue University. The author of more than 10 books, including Microwave Materials and Fabrication Techniques, Third Edition (Artech House, 2000), he has taught U.S. Navy training courses and professional courses on microwave technology throughout the United States, Canada, and Norway. Before joining the faculty at Purdue, he was a senior engineer for ITT Aerospace Division. He earned his B.S. in electrical engineering from Syracuse University and his M.S. in electrical engineering from Purdue University.