Description
Solid state power amplifiers (SSPA) are a critical part of many microwave systems. Designing SSPAs with monolithic microwave integrated circuits (MMIC) has boosted device performance to much higher levels focused on PA modules. This cutting-edge book offers engineers practical guidance in selecting the best power amplifier module for a particular application and interfacing the selected module with other power amplifier modules in the system. It also explains how to identify and mitigate peripheral issues concerning the PA modules, SSPAs, and microwave systems.
This authoritative volume presents the critical techniques and underpinnings of SSPA design, enabling professionals to optimize device and system performance. Engineers gain the knowledge they need to evaluate the optimum topologies for the design of a chain of microwave devices, including power amplifiers. Additionally, the book addresses the interface between the microwave subsystems and the primary DC power, the control and monitoring circuits, and the thermal and EMI paths. Packed with 240 illustrations and over 430 equations, this detailed book provides the practical tools engineers need for their challenging projects in the field.
Table Of Contents
Part One: Useful Microwave Design Concepts -- Lumped Components in RF and Microwave Circuitry. Transmission Lines. S-Parameters. Microstrip Transmission Lines. Circuit Matching and VSWR. Noise in Microwave Circuits. Non-Linear Signal Distortion. System Cascade and Dynamic Range Analysis. Part Two: Designing the Power Amplifier -- Defining the Output Power Requirements for a Communication Link and Other Wireless Systems. Parallel Amplifier Topology Enhancing SSPA Performance. MMIC Amplifier Modules for Use in Parallel Combining Circuits. Measuring and Matching the Impedance of High Power MMIC Amplifier Modules. Power Dividers and Combiners Used in Parallel Amplifier SSPAs. Power Amplifier Chain Analysis. Part Three: Designing the Power Amplifier System -- RF Signal Monitoring Circuits. DC Power Interface with the RF Signal Path. SSPA DC Voltage and Current. Thermal Design and Reliability. Electromagnetic Interference (EMI). Appendices. Index.