Here's the book to keep handy when you have to overcome obstacles in design, simulation, fabrication and application of MEMS sensors. This practical guide to design tools and packaging helps you create the sensors you need for the full range of mechanical microsensor applications. Critical physical sensing techniques covered include piezoresistive, piezoelectric, capacative, optical, resonant, actuation, thermal, and magnetic, as well as smart sensing. This new resource explores all the major areas of mechanical microsensors and takes an especially close look at pressure and inertial sensors. Engineers in industry and academia can tap into current and future market trends in such key applications areas for mechanical microsensors as force and torque, flow in microfluidics, and displacement. A thorough introduction to physical sensors, MEMS, and the properties of silicon brings you up to speed with the state of the art of this groundbreaking technology.
Introduction - Motivation. Physical Sensors. Market Review: Current and Future. Why MEMS? Si Properties. Materials and Fabrication Techniques - Silicon, Oxide and Nitride, SOI. Metalization. Glass Pyrex, Quartz, SiC, Diamond, Sapphire. Epitaxy. Oxidization. Thin Film Techniques (CD, Sputtering, LB, Spin-on Methods, Sol-Gel). Thick-Film. Anodic Bonding. Fusion Bonding. Surface Micromachining. Bulk Micromachining. DRIE. LIGA. Photolithography, E-Beam.; Design Tools - System Level Design. Review of MEM Packages. Finite Analysis and Methods. Thermal Design Issues: How It 's Done. Simulation. Masks, CAD Layout, LEDit, Cadence, etc.; Packaging - Types of Standard Packages. Wire Bonding Methods. Thermal Issues. Stress Isolation. Coatings. Hermetic Sealing and Vacuum Packaging. ; Physical Sensing Techniques - Piezoresistive. Piezoelectric. Capacative. Optical. Resonant. Actuation Techniques. Thermal. Magnetic. Smart Sensors, CMOS, and SOI.; Pressure Sensors - Commercial Devices. Research Devices. Future Devices.; Force and Torque Sensors - Commercial Devices. Research Devices. Future Devices.; Inertial Sensors - Commercial Devices. Research Devices. Future Devices.; Flow Sensors for Microfluidics - Commercial Devices. Research Devices. Future Devices.; Displacement Sensors - Commercial Devices. Research Devices. Future Devices.;
-
Stephen Beeby
Steven Beeby is an advanced research fellow at the School of Electronics and Computer Science, University of Southampton. He also the co-author of MEMS Mechanical Sensors (Artech House, 2004) and numerous journal articles and conference papers. He holds an Eng. (Hons) degree in mechanical engineering from the University of Portsmouth, U.K. and a Ph.D. in mechanical Engineering from the University of Southampton.
-
Graham Ensell
Graham Ensel is a senior research fellow at the University of Southampton. He received his B.Sc. in physics from the Imperial College, London University and his Ph.D. in medical physics from the Royal Free Medical School, University of London.
-
Michael Kraft
Michael Kraft is a lecturer in the School of Electronics and Computer Science, University of Southampton. He holds a Dipl-Ing degree in electronics form Alexander von Humboldt University, Erlangen, Germany, and a Ph.D. in electronics and control from Coventry University, Coventry, U.K.
-
Neil White
Neil White is head of the Electronics Systems and Devices Group and deputy head of school for enterprise at the School of Electronics and Computer Scienterprise at the School of Electronics and Computer Science, University of Southampton. He also the co-author of MEMS Mechanical Sensors (Artech House, 2004). A fellow of the Institution of Electrical Engineers (IEE) and the Institute of Physics (IOP), as well as a senior member of the IEEE, he earned B.Sc. in electronics engineering at North Staffs Polytechnic and a Ph.D. in sensors at the University of Southampton.